Intel Flash Memory Advanced Programming

and Handling Literature Guide

Enables Implementation of Tape-and-Reel at Board Assembly

Thanks to advanced cost-effective technology, a diverse product line and application-optimized feature sets, Intel's Flash memory products are today the preferred solutions for both traditional and emerging applications. Intel's Small Outline Packaging (SOP) and tape-and-reel shipping media enables you to take advantage of higher-density flash memories with greater functionality while shrinking required board space and simplifying the end system manufacturing flow.

New technologies, such as SOP and tape-and-reel, create opportunities for innovative and visionary engineers to exploit new approaches in solving traditional challenges. Intel and its vendor partners have developed a literature guide entitled, “Flash Memory Advanced Programming and Handling” which provides information on various on-board-programming techniques and handling solutions. By choosing alternatives to traditional off-line flash memory programming for your system manufacturing process, you can eliminate potentially damaging manual handling steps, minimize programmed device inventory and maximize the utilization of existing board test equipment.

The new kit is available through the Intel Literature Centers in the United States and Swindon, order number 297787 (U.S. 800-548-4725 or +1-708-296-9333 from overseas. Swindon +44(0)1793-431155). Intel encourages you, after inspecting the information, to contact the vendors included in the kit. They are ready and willing to help you solve the unique flash memory programming and handling challenges for your leading-edge products.

For information on our full portfolio of tools, including tools developed by our vendor partners, visit our tools portfolio at Flash Components Tools and Software or Flash Cards Tools and Software or contact your local Intel or distribution sales office.